0

IEC PAS 62307:2002 ED1

Test method for the measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits IEC PAS 62307:2002 ED1

Publication date:   Mar 12, 2002

General information

99.60 Withdrawal effective   Jul 24, 2006

IEC

TC 47

Publicly Available Specification

31.200   Integrated circuits. Microelectronics

Buying

Replaced

Language in which you want to receive the document.

Scope

Details the procedures for the measurement of characteristic bulk material properties of moisture diffusivity and water solubility in organic materials used in the packaging of IC components. These two material properties are important parameters for the effective reliability performance of plastic packaged ICs after exposure to moisture and subjected to high temperature solder reflow.

Life cycle

NOW

WITHDRAWN
IEC PAS 62307:2002 ED1
99.60 Withdrawal effective
Jul 24, 2006

REVISED BY

WITHDRAWN
IEC 60749-39:2006 ED1