IEC 61189-1:1997+AMD1:2001 CSV ED1.1

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

Publication date:   Nov 22, 2001

General information

60.60 Standard published   Nov 22, 2001

IEC

TC 91 Electronics assembly technology

International Standard

31.180   Printed circuits and boards

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Scope

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies. This consolidated version consists of the first edition (1997) and its amendment 1 (2001). Therefore, no need to order amendment in addition to this publication.

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PUBLISHED
IEC 61189-1:1997+AMD1:2001 CSV ED1.1
60.60 Standard published
Nov 22, 2001