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IEC PAS 62293:2001 ED1

Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)

Publication date:   Nov 28, 2001

95.99 Withdrawal of Standard   Oct 29, 2004

General information

95.99 Withdrawal of Standard   Oct 29, 2004

IEC

TC 91 Electronics assembly technology

Publicly Available Specification

33.200   Telecontrol. Telemetering

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Scope

Establishes the specific requirements for organic high-density interconnect layers with microvia technology as well as the quality and reliability assurance requirements that shall be met for their acquisition.

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IEC PAS 62293:2001 ED1
95.99 Withdrawal of Standard
Oct 29, 2004