IEC 61192-5:2007 ED1

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies

Publication date:   May 23, 2007

95.99 Withdrawal of Standard   Nov 30, 2018

General information

95.99 Withdrawal of Standard   Nov 30, 2018

IEC

TC 91 Electronics assembly technology

International Standard

31.190   Electronic component assemblies

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Scope

IEC 61192-5:2007 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products. It also contains guidance on design matters where they have relevance to rework.

Life cycle

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IEC 61192-5:2007 ED1
95.99 Withdrawal of Standard
Nov 30, 2018