IEC 61760-1:2006 ED2

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

Publication date:   Apr 10, 2006

General information

99.60 Withdrawal effective   Jul 14, 2020

WPUB   

IEC

TC 91 Electronics assembly technology

International Standard

31.240   Mechanical structures for electronic equipment

Buying

Revised

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Scope

IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern:
- requirements related to lead-free soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.

Life cycle

PREVIOUSLY

Revises
IEC 61760-1:1998 ED1

NOW

WITHDRAWN
IEC 61760-1:2006 ED2
99.60 Withdrawal effective
Jul 14, 2020

REVISED BY

PUBLISHED
IEC 61760-1:2020 ED3