IEC 60191-6-9 ED1

Mechanical standardization of semiconductor devices - Part 6-9: General rules for the preparation of outline drawing of surface mounted semiconductor device packages - Design guideline of integrated circuits for Plastic Quad Flat Package (P-QFP)

General information

30.98 Project deleted   Feb 9, 2005

IEC

TC 47/SC 47D Semiconductor devices packaging

International Standard

Life cycle

NOW

ABANDON
IEC 60191-6-9 ED1
30.98 Project deleted
Feb 9, 2005