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IEC 60749-6:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature IEC 60749-6:2002 ED1

Publication date:   Apr 12, 2002

General information

99.60 Withdrawal effective   Mar 3, 2017

WPUB   

IEC

TC 47

International Standard

31.080.01   Semiconductor devices in general

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Revised

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Scope

Aims at testing and determining the effect on all semiconductor electronic devices of storage at elevated temperature without electrical stress applied. This test is considered non-destructive.

The contents of the corrigendum of August 2003 have been included in this copy.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 62205:2000 ED1

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

NOW

WITHDRAWN
IEC 60749-6:2002 ED1
99.60 Withdrawal effective
Mar 3, 2017

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60749-6:2002/COR1:2003 ED1

REVISED BY

PUBLISHED
IEC 60749-6:2017 ED2