IEC 60749-3:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection

Publication date:   Apr 9, 2002

General information

99.60 Withdrawal effective   Mar 3, 2017

WPUB   

IEC

TC 47 Semiconductor devices

International Standard

31.080.01   Semiconductor devices in general

Buying

Revised

Language in which you want to receive the document.

Scope

Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.

The contents of the corrigendum of August 2003 have been included in this copy.

Life cycle

PREVIOUSLY

Replaces
IEC PAS 62163:2000 ED1

NOW

WITHDRAWN
IEC 60749-3:2002 ED1
99.60 Withdrawal effective
Mar 3, 2017

CORRIGENDA / AMENDMENTS

Corrected by
IEC 60749-3:2002/COR1:2003 ED1

REVISED BY

PUBLISHED
IEC 60749-3:2017 ED2