IEC PAS 62213:2001 ED1

Specification and characterization methods for nonwoven para-aramid reinforcement

Publication date:   Feb 13, 2001

95.99 Withdrawal of Standard   Oct 29, 2004

General information

95.99 Withdrawal of Standard   Oct 29, 2004

IEC

TC 91 Electronics assembly technology

Publicly Available Specification

31.180   Printed circuits and boards

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Scope

Covers the requirements for nonwoven para-aramid reinforcement used in the manufacture of base materials primarily for rigid or multilayer printed boards in electrical and electronic applications. Determines the nomenclature, definitions, general comments, and physical requirements for reinforcement made from nonwoven para-aramid fibres.

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WITHDRAWN
IEC PAS 62213:2001 ED1
95.99 Withdrawal of Standard
Oct 29, 2004