IEC PAS 62203:2000 ED1

Guide for the standard probe pad sizes and layouts for wafer-level electrical testing

Publication date:   Nov 28, 2000

95.99 Withdrawal of Standard   May 17, 2004

General information

95.99 Withdrawal of Standard   May 17, 2004

IEC

TC 47 Semiconductor devices

Publicly Available Specification

31.080.01   Semiconductor devices in general

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Scope

Applies to double- and single-column arrays of metal probe pads, on a semiconductor wafer or chip, that are electrically connected to one or more test structures.

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IEC PAS 62203:2000 ED1
95.99 Withdrawal of Standard
May 17, 2004