IEC 61760-2:2021 ED3

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide IEC 61760-2:2021 ED3

Publication date:   Jul 16, 2021

General information

60.60 Standard published   Jul 16, 2021

IEC

TC 91

International Standard

31.240   Mechanical structures for electronic equipment

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IEC 61760-2:2021 is available as IEC 61760-2:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 61760-2:2021 specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". Cross-references for references from this edition 3 to the previous edition 2 of this document are listed in Annex X of this document.

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IEC 61760-2:2007 ED2

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PUBLISHED
IEC 61760-2:2021 ED3
60.60 Standard published
Jul 16, 2021